2.0W/mK Ceramic Filled Silicone Thermal Pad for AI Processors and Server Applications

TIF^®100-20-02U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces,and the susceptibility of delicate components to mechanical damage.

• Good thermal conductivity
• Ultra-soft and highly conformable
• Self-adhesive without the need for additional surface adhesive
• Good insulation performance

• Home appliance industry
• Power module
• Wearable devices
• Solar photovoltaic panels
• LED lighting fixtures
• Routers
• Medical devices
• Audio electronic products
• Unmanned aerial vehicles (UAV)
• Photovoltaic systems
• Signal communication
• New energy vehicles
• Motherboard chip
• Radiator
• AI Processors AI Servers

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF^® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

• Our value message is "Do it right the First time, total quality control"
• Our core competency is thermal conductive interface materials
• Competitive advantage products
• Confidentiality agreement and Business Secret Contract
• Free sample offer
• Quality assurance contract