Thermal Conductive Silicone Thermal Pad With 3.0W/mK For Heat Management
Product Overview
The TIF®100-30-15U Series is an ultra-soft thermal interface material specifically designed to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It effectively addresses issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.
Key Features
- High thermal conductivity (3.0 W/mK)
- Super soft and highly compliant
- Self-adhesive without additional surface adhesives
- Excellent insulation performance
Applications
- Laptop / tablet / PC server
- New energy power battery / vehicle equipment
- Switching power supply / UPS
- Video / security equipment
- Any heating element and radiator
- Semiconductor
- AI Computing
- Automotive Electronics
- Power Electronics
Technical Specifications of TIF®100-30-15U Series
| Property |
Value |
Test Method |
| Color |
Purple |
Visual |
| Construction & Composition |
Ceramic filled silicone elastomer |
- |
| Density (g/cm³) |
3.0 |
ASTM D792 |
| Thickness Range (inch/mm) |
0.010~0.020 / 0.030~0.200
0.25~0.50 / 0.75~5.00
|
ASTM D374 |
| Hardness (Shore 00) |
65 / 27 |
ASTM 2240 |
| Continuous Use Temp |
-40 to 200℃ |
- |
| Breakdown Voltage (V/mm) |
≥ 5500 |
ASTM D149 |
| Dielectric Constant@1MHz |
7.0 |
ASTM D150 |
| Volume Resistivity (Ohm-meter) |
＞1.0×10¹² |
ASTM D257 |
| Thermal Conductivity (W/m-K) |
3.0 |
ASTM D5470 / ISO22007 |
| Fire Rating |
V-0 |
UL 94 (E331100) |
Product Specifications
Standard Thickness: 0.010" (0.25 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm ×406 mm)
Component Codes
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging & Lead Time
Packaging Details:
- PET film or foam for protection
- Paper card to separate each layer
- Export carton inside and outside
- Customized to meet customer requirements
Lead Time: Quantity: 5000 pieces - To be negotiated
About Ziitek
Ziitek, founded in 2006, is a high-tech enterprise specializing in research and development of heat conduction, heating, sealing and EMI products. Its headquarters is in Dongguan, Guangdong Province, with production bases in Kunshan, Taiwan Province and Viet Nam. The company strictly abides by the international quality management system, and has passed the authoritative certifications such as IATF16949:2016, ISO9001:2015, QC080000:2017 and ISO14001:2015. The whole series of products conform to ROHS, REACH and UL specifications. From thermal interface materials to EMI shielding, from heating products to sealing engineering plastics, Zhaoke serves global customers with strict quality standards and is committed to becoming a reliable strategic partner.
Frequently Asked Questions
Q: Are you a trading company or manufacturer?
A: We are manufacturer in China and VietNam.
Q: Is GAP PAD offered with an adhesive?
A: Most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
Q: What Is a Thermal Interface Material (TIM)?
A: Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases and phase-change materials.
Q: What Is Thermal Conductivity? Is Higher Thermal Conductivity Always Better?
A: Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m*K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression and contact area.
Q: What Is Thermal Resistance in Thermal Interface Materials?
A: Thermal resistance represents the resistance to heat flow through a material or interface. For TIM applications, actual thermal resistance can be more meaningful than thermal conductivity alone.
Q: What Is the Difference Between Thermal Conductivity and Thermal Resistance?
A: Thermal conductivity describes the intrinsic heat-conduction capability of a material, while thermal resistance also depends on thickness, contact area and interface conditions.
Q: Does Higher Thermal Conductivity Always Mean Better Cooling?
A: Not necessarily. Thickness, interface contact, compression and actual thermal resistance can significantly affect final cooling performance.
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