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High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance

High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance

  • High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance
  • High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance
High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHS
Model Number: TIE380-25
Payment & Shipping Terms:
Minimum Order Quantity: 10kg
Price: 1-100USD/kg
Packaging Details: 1kg/can
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 10000kg/month
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Detailed Product Description
Material: Epoxy Glue Usage: Bonding Electronics
Appearance Sured: Dull Gray Solid Continuous Use Temp: -40 To 180℃
Thermal Conductivity: 2.5 W/mK NAME: Thermal Epoxy Glue
High Light:

high heat epoxy glue

,

heat resistant epoxy glue

2019 high thermal conductivity thermal conductive epoxy glue good adhesive for bonding electronics

 

TIE™380-25High Performance Thermal Conductivity Of The Epoxy Adhesive

 

Product Summary:

 

TIE™380-25  is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling

 

Feature

 

Outstanding thermal performance 2.5W/mK
High tack surface reduces contact resistance
RoHS compliant
UL recognized
Fiberglass reinforced for puncture, shear and tear resistance
Easy release construction

 

Applications

 

Heat pipe thermal solutions
Memory Modules
Mass storage devices
Automotive electronics
Set top boxes
Audio and video components
IT infrastructure
GPS navigation and other portable devices
 

 

                                                Typical Properties of TIETM380-25

 

Chemical type Epoxy Test Method
Appearance uncured Gray Paste Visual
Appearance cured Dull Gray Solid Visual
Components One Component *****
Heat Capacity 0.7 l/g-K ASTM C351
Key Substrates Metals, ceramics *****
Hardness 92 Shore A ASTM 2240
Continuous Use Temp -40 to 180℃ *****
Tensile strength Al/Al @25°C >2800psi *****
Thermal Conductivity 2.5 W/m-K ASTM D5470

 

Application Features:TIE™380-25

 

Color Gray

Viscosity@25 140,000 cPs

Specific Gravity@25 2.1 g/cc

Shelf life @25° 10 Days

@0° 6 Months

(Storage methods and temperature will affect the shelf life)

 

Curing procedures:

Curing temperature Curing time

100° 3 Hours

125 1.5 Hour

150 20 Minutes

170 5 Minutes

 

Package:

1kg/can

High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance 0

 

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Sales Manager

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)

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