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High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance

High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance

    • High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance
    • High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance
  • High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance

    Product Details:

    Place of Origin: China
    Brand Name: Ziitek
    Certification: RoHS
    Model Number: TIE380-25

    Payment & Shipping Terms:

    Minimum Order Quantity: 10kg
    Price: 1-100USD/kg
    Packaging Details: 1kg/can
    Delivery Time: 3-8 work days
    Payment Terms: T/T
    Supply Ability: 10000kg/month
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    Detailed Product Description
    Material: Epoxy Glue Usage: Bonding Electronics
    Appearance Sured: Dull Gray Solid Continuous Use Temp: -40 To 180℃
    Thermal Conductivity: 2.5 W/mK NAME: Thermal Epoxy Glue

    2019 high thermal conductivity thermal conductive epoxy glue good adhesive for bonding electronics

     

    TIE™380-25High Performance Thermal Conductivity Of The Epoxy Adhesive

     

    Product Summary:

     

    TIE™380-25 is a one component, heat cured epoxy adhesive. It has excellent thermal conductivity and bond strength. TIE™380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure.

     

    Feature

     

    > Good thermal conductivity: 2.5W/mK

    > Good maneuverability andadhesion performance

    > Low shrinkage

    > Low viscosity, easy-to-gas emissions

    > Good solvent resistance, water resistance

    > Longer working hours

    > Excellent resistance to thermal shock

     

     

                                                    Typical Properties of TIETM380-25

     

    Chemical type Epoxy Test Method
    Appearance uncured Gray Paste Visual
    Appearance cured Dull Gray Solid Visual
    Components One Component *****
    Heat Capacity 0.7 l/g-K ASTM C351
    Key Substrates Metals, ceramics *****
    Hardness 92 Shore A ASTM 2240
    Continuous Use Temp -40 to 180℃ *****
    Tensile strength Al/Al @25°C >2800psi *****
    Thermal Conductivity 2.5 W/m-K ASTM D5470

     

    Application Features:TIE™380-25

     

    Color Gray

    Viscosity@25 140,000 cPs

    Specific Gravity@25 2.1 g/cc

    Shelf life @25° 10 Days

    @0° 6 Months

    (Storage methods and temperature will affect the shelf life)

     

    Curing procedures:

    Curing temperature Curing time

    100° 3 Hours

    125 1.5 Hour

    150 20 Minutes

    170 5 Minutes

     

    Package:

    1kg/can

    High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance

    Contact Details
    Dongguan Ziitek Electronic Materials & Technology Ltd

    Contact Person: Sales Manager

    Send your inquiry directly to us (0 / 3000)

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