Name: Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF050-11
Price: 49.10 USD
Availability: InStock

Home Products Thermal Conductive Gel

Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF050-11

Payment & Shipping Terms:

Minimum Order Quantity:	1000tube
Price:	0.1-100USD/KG
Packaging Details:	300cc/tube
Delivery Time:	3-8 WORK DAYS
Payment Terms:	T/T
Supply Ability:	10000KG/MONTH

Contact Now

Detailed Product Description

Products Name:	Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment	Shape:	Putty
Application:	Semiconductor Automatic Laboratory Equipment	Color:	Gray
Made By:	Ceramic Filled Silicon Material	Keyword:	Thermal Gel
Recommended Operating Temp:	-45-200 ℃	Density(g/cc):	3.20
Highlight:	heat insulation putty , heat transfer putty , silicone thermally conductive putty gray

Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

TIF^®050-11 is a soft silicone gel-based gap filler pad, formulated with aspecial blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF^®050-11 has a high erviscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocesors, PPGAs, micro

BGA packages, BGA packages, DSP chips, circular silicon chips,LED lighting, and other high-power electronic components.

Feature

>Thermal conductivity: 5.0 W/mK
>Soft, very low compression
>Low thermal impedance
>Operate automatically

>Proven long-term reliability

Application

>Heat-sink & frame
>LED backlight module, LED lighting
>High speed hardware driver
>Micro heat pipe
>Vihicel enginee controller
>Telecom industry
>Semiconductor automatic laboratory equipment

TIF^®050-11 Typical Properties
Property	Value	Test method
Color	Gray	Visual
Construction & Composition	Ceramic filled silicon material	-
Flow Rate(g/min)	40	Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Flow Rate(g/min)	40	Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Density(g/cc)	3.20g/c	ASTM D297
Thermal conductivity	5.0W/mK	ASTM D5470
Thermal Impedance @10psi (℃.in²w)	0.077	ASTM D5470
Thermal Impedance @50psi (℃.in²w)	0.068	ASTM D5470
Recommended Operating Temp	-45 ~200°C	Ziitek Test Method
Dielectric Strength(V/mm)	≥4000	ASTM D149
Bond Line Thickness(mm)	0.20	Ziitek Test Mothod
Flame Rating	V-0	UL 94
Shelf Life	12 months	-

Product Specification:

30 cc/pcs, 98 pcs/box; 300 cc/pcs, 6 pcs/box.
Custom packaging available for automation use. Please contact us for confirming.
If you want to know our thermal products, please visit our website.

Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment 0

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Tag:

heat transfer putty,

thermally conductive gap filler,

heat insulation putty

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Other Products

High Performance Yellow Thermally Conductive Gel For Radiating Modules Components

Product ame: High Performance Yellow Thermally Conductive Gel For Radiating Modules Components

Color: Yellow

Application: Radiating Modules Components

keyword: Thermal gel

Thermally Conductive Putty thermal gel 3.5W/mK for Graphics card graphics memory power notebook cooling silicone

Product name: Thermally Conductive Putty thermal gel 3.5W/mK for Graphics card graphics memory power notebook cooling silicone

Material: Ceramic filled silicon material

Color: Blue

Application: Graphics card graphics memory power notebook cooling silicone

Gray Thermal Conductive Gel Super High Thermal Conductivity Thermal Conductive Gel 4.5W Silica Gel For Micro Heat Pipe

Products name: Gray Thermal Conductive Gel Super High Thermal Conductivity Thermal Conductive Gel 4.5W Silica Gel For Micro Heat Pipe

Application: Micro Heat Pipe

Color: Gray

Package: 30cc/Pcs

Blue Thermally Conductive Putty Heat Transfer thermal Silicone gel 2.5g/CC For Telecom Industry

Products name: Blue Thermally Conductive Putty Heat Transfer thermal Silicone gel 2.5g/CC For Telecom Industry

Application: Telecom Industry

Color: Blue

Keyword: Thermal gel

3.0W/M.K One-Component Thermal Putty Thermal Conductive Gel For Battery Power Silicone Interface Materials

Name: 3.0W/M.K One-Component Thermal Putty Thermal Conductive Gel For Battery Power Silicone Interface Materials

Application: Battery Power

Color: Blue

keyword: 3.0W/mK Thermal Gel

Wholesale Thermally Conductive Gel For Heat Sink Any Heat Generating Semiconductor

Name: Wholesale Thermally Conductive Gel For Heat sink any Heat Generating Semiconductor

Thermal Conductivity: 3.0W/mk

Hardness: 65 Shore 00

Color A/B: White / blue

3.0W/MK Two-Parts Thermally Conductive Gel For Automotive Electronics

Products name: 3.0W/MK Two-Parts Thermally Conductive Gel For Automotive Electronics

application: Automotive Electronics

Color: Blue

Pot Life @25℃: 30min

Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment

Very Low Compression Silicone-Based Thermal Gel For Semiconductor Automatic Laboratory Equipment

heat insulation putty

heat transfer putty

silicone thermally conductive putty gray

heat transfer putty,

thermally conductive gap filler,

heat insulation putty