Name: Thermally Conductive Putty thermal gel 3.5W/mK for Graphics card graphics memory power notebook cooling silicone
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF035-05
Price: 49.10 USD
Availability: InStock

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Thermally Conductive Putty thermal gel 3.5W/mK for Graphics card graphics memory power notebook cooling silicone

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	RoHS
Model Number:	TIF035-05

Payment & Shipping Terms:

Minimum Order Quantity:	1000tube
Price:	0.1-100USD/KG
Packaging Details:	30cc/PCS
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	10000KG/month

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Detailed Product Description

Product Name:	Thermally Conductive Putty Thermal Gel 3.5W/mK For Graphics Card Graphics Memory Power Notebook Cooling Silicone	Material:	Ceramic Filled Silicon Material
Color:	Blue	Application:	Graphics Card Graphics Memory Power Notebook Cooling Silicone
Flame Retardancy:	UL 94V-0	Keyword:	Thermal Gel
Feature:	Low Thermal Impedance	Thermal Conductivity:	3.0W/mK
Highlight:	heat transfer putty , thermally conductive gap filler , 30cc/tube Thermally Conductive Putty

Thermally Conductive Putty thermal gel 3.5W/mK for Graphics card graphics memory power notebook cooling silicone

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL

Products Description

TIF^®035-05 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF^®035-05 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular Isilicon chips, LED lighting, and other high-power electronic components.

Feature

>Thermal conductivity: 3.0 W/mK
>Soft, very low compression
>Low thermal impedance
>Operate automatically
>Proven long-term reliability

Application

>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver
>Micro heat pipe
>Vihicel enginee controller
>Telecom industry
>Semiconductor automatic laboratory equipment

TIF^®035-05 Typical Properties
Property	Value	Test method
Color	Blue	Visual
Construction & Composition	Ceramic filled silicon material	-
Flow Rate(g/min)	30	Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Flow Rate(g/min)	30	Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Density(g/cc)	3.25g/c	ASTM D297
Thermal conductivity	3.5W/mK	ASTM D5470
Thermal Impedance @10psi (℃.in²w)	0.08	ASTM D5470
Thermal Impedance @50psi (℃.in²w)	0.075	ASTM D5470
Recommended Operating Temp	-45 ~200°C	Ziitek Test Method
Dielectric Strength(V/mm)	≥4000	ASTM D149
Bond Line Thickness(mm)	0.1	Ziitek Test Mothod
Flame Rating	V-0	UL 94
Shelf Life	12 months	-

Product Specification:

30 cc/pcs, 98 pcs/box; 300 cc/pcs, 6 pcs/box.
Custom packaging available for automation use. Please contact us for confirming.
If you want to know our thermal products, please visit our website.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

FAQ:
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q: How much are the pads?
A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.