Name: Thermal Conductive Silica Gel High Thermal Conductivity 7.0W CPU Heat Dissipation Manufacturer
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF070-11
Price: 49.10 USD
Availability: InStock

Home Products Thermal Conductive Gel

Thermal Conductive Silica Gel High Thermal Conductivity 7.0W CPU Heat Dissipation Manufacturer

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF070-11

Payment & Shipping Terms:

Minimum Order Quantity:	1000tube
Price:	0.1-100USD/KG
Packaging Details:	30cc/PCS
Delivery Time:	3-8 WORK DAYS
Payment Terms:	T/T
Supply Ability:	10000KG/MONTH

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Detailed Product Description

Products Name:	Thermal Conductive Silica Gel High Thermal Conductivity 7.0W CPU Heat Dissipation Manufacturer	Application:	For CPU Heat Dissipation
SPecific Gravity:	3.5g/cc	Color:	Gray
Flame Rating:	UL 94 V-0	Certifications:	RoHS
Thermal Conductivity:	7.0 W/m-K	Keywords:	Thermal Conductive Silica Gel
Highlight:	Silicone Thermal Conductive Putty , Thermal Gap Filler Gel , Thermal Gap Filler Gel Manufacturer

Thermal Conductive Silica Gel High Thermal Conductivity 7.0W CPU Heat Dissipation Manufacturer

Products description

TIF^®070-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF^®070-11 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular silicon chips, LED lighting, and other high-power electronic components.
Thermal Conductive Silica Gel High Thermal Conductivity 7.0W CPU Heat Dissipation Manufacturer 0

Feature

> Thermal conductivity :7.0W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
> Proven long-term reliability

Application

> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controler
> Telecom industry
> Semiconductor 'automatic laboratory equipment.

TIF^®070-11 Typical Properties
Property	Value	Test method
Color	Gray	Visual
Construction & Composition	Ceramic filled silicon material	-
Flow Rate(g/min)	30	Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Flow Rate(g/min)	30	Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
Density(g/cc)	3.50g/c	ASTM D297
Thermal conductivity	7.0W/mK	ASTM D5470
Thermal Impedance @10psi (℃.in²w)	0.142	ASTM D5470
Thermal Impedance @50psi (℃.in²w)	0.12	ASTM D5470
Recommended Operating Temp	-45 ~200°C	Ziitek Test Method
Dielectric Strength(V/mm)	≥4000	ASTM D149
Bond Line Thickness(mm)	0.2	Ziitek Test Mothod
Flame Rating	V-0	UL 94
Shelf Life	12 months	-

Packing details

30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
Custom packaging available for automation use. Please contact us for confirming.
If you want to know our thermal products, please visit our website.

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Thermal Conductive Silica Gel High Thermal Conductivity 7.0W CPU Heat Dissipation Manufacturer 1
FAQ:

Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

Tag:

heat transfer putty,

thermally conductive gap filler,

heat insulation putty

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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Thermal Conductive Silica Gel High Thermal Conductivity 7.0W CPU Heat Dissipation Manufacturer

Thermal Conductive Silica Gel High Thermal Conductivity 7.0W CPU Heat Dissipation Manufacturer

Silicone Thermal Conductive Putty

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