|Place of Origin:||China|
|Minimum Order Quantity:||1000tube|
|Delivery Time:||3-8 WORK DAYS|
|Application:||Micro Heat Pipe||Color:||Black|
|Package:||300cc/tube||Flame Rating:||UL 94 V-0|
300cc/Tube Thermally Conductive Putty,
Micro Heat Pipe Thermally Conductive Putty,
4.5 w/mk thermal conductive putty
Thermally conductive putty 300cc/tube for Micro Heat Pipe with using temperature -45 ~200°C
With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Ziitek TIF045-01 is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF045-01 is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
As a soft silicone putty thermal gap filler, TIF045-01 blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF100-15 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
TIF045-01 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF100-15 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .
TIF045-01 Series Datasheet-REV02.pdf
> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe ,Vihicel enginee controler
> Telecom industry
> Thermal conductivity: 4.5W/mK
> Soft, very low compression
> Operate automaticly
|Construction & Composition||Ceramic filled silicon material||**********|
|Specific Gravity||2.95 g/cc||ASTM D297|
|Thermal conductivity||4.5 W/mK||ISO 22007-2|
|Thermal diffusivity||1.651 mm2/s||ISO 22007-2|
|Specific heat capacity||2.7 MJ/m3K||ISO 22007-2|
|Continuous Use Temperature||-45 ~200°C||******|
|Dielectric breakdown strength||200 V/mil||ASTM D149|
30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Contact Person: Sales Manager