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Memory Modules Heat Sink Silicone Pad 3MM Thickness

Memory Modules Heat Sink Silicone Pad 3MM Thickness

  • Memory Modules Heat Sink Silicone Pad 3MM Thickness
  • Memory Modules Heat Sink Silicone Pad 3MM Thickness
Memory Modules Heat Sink Silicone Pad 3MM Thickness
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF1120-05UF thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Hardness: 75 Shore 00 Color: Blue
Dielectric Constant: 3.9 MHz Feature: High Durability
Name: Dielectric Breakdown Voltage >5500 VAC Electrically Isolating Blue Thermal Pad For Memory Modules Keyword: Thermal Gap Pad
High Light:

Memory Modules Heat Sink Silicone Pad

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3MM Thickness Heat Sink Silicone Pad

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3MM Thermal Pad For Heat Sink

Dielectric Breakdown Voltage >5500 VAC Electrically Isolating Blue Thermal Pad for Memory Modules

 

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

TIF100-05UF-Datasheet-REV02.pdf

 

Ziitek TIF1120-05UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


 

<Good thermal conductive:1.5 W/mK
<Thickness: 3.0mmT
<Hardness:75 Shore 00
<Colour: Blue

<Electrically isolating
<High durability
<Good thermal conductive


 

 

Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

 

 
Typical Properties of TIF1120-05UF
 
Product Name TIF1120-05UF Series
Colour Blue
Construction & Compostion Ceramic filled silicone elastomer
Specific gravity 2.2 g/cc
Thickness 3.0mmT
Hardness 75 Shore 00
Dielectric constant@1MHz 3.9 MHz
Continuos Use Temp -40 to 160℃
Dielectric Breakdown Voltage >5500 VAC
Thermal conductivity 1.5 W/mK
Volume Resistivity 1.0*1012 Ohm-cm

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Memory Modules Heat Sink Silicone Pad 3MM Thickness 0
 

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

 

Memory Modules Heat Sink Silicone Pad 3MM Thickness 1
 
FAQ

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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