Highly Phase Change Material With 5.0 W/mK Thermal Conductivity And 50-60℃ Phase Change Softening Temperature For Load Processor

Ziitek, founded in 2006, is a high-tech enterprise driven by independent research and development, specializing in the development and manufacture of heat conduction, heating, sealing, and EMI products. The company has assembled a team of senior engineers to form its R&D core. Amid the continuous innovation of the manufacturing industry, Ziitek has consistently pushed the boundaries of material technology, developing core products such as TIF thermal pads, TIG thermal paste, TIC phase change materials, TIF900 series EMI materials, K-heat heating products, and Z-foam seals. Headquartered in Dongguan with production bases in Kunshan, Taiwan Province, and Vietnam, the company empowers new energy, AI, 5G, aerospace, and other fields through technological innovation, delivering leading thermal management solutions to global customers.

• High thermal conductivity
• Soft surface
• Low thermal resistance
• Self-adhesive — no additional adhesive required

• High-frequency microprocessors
• Notebook and desktop PCs
• Computer servers
• Memory modules
• Cache chips
• IGBTs

• Standard Thickness:0.004" (0.10 mm), 0.005" (0.13 mm), 0.006" (0.15 mm), 0.008" (0.20 mm), 0.010" (0.25 mm), 0.012" (0.30 mm)
• Standard Size:11.811" × 19.685" (300 mm × 500 mm)
• Pressure-sensitive Adhesive:Not applicable to TIC® series products

The TIC® series can be die-cut into different shapes. If you require different thicknesses and specifications, or would like to learn more about thermal conductive materials, please contact our company.

1. 1.Our value message is "Do it right the first time, total quality control."
2. 2.Our core competency is thermal conductive interface materials.
3. 3.Competitive advantage products.
4. 4.Confidentiality agreement and business secret contract.
5. 5.Free sample offer.
6. 6.Quality assurance contract.