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Low Thermal Resistance Phase Change Pad For Electronic Components

Low Thermal Resistance Phase Change Pad For Electronic Components

Low Thermal Resistance Phase Change Pad For Electronic Components
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Low Thermal Resistance Phase Change Pad For Electronic Components
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHS
Model Number: TIC800A-AL series
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*23*12cm
Delivery Time: 3-6 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Keyword: Phase Change Pad Density: 2.5 G/cc
Thermal Conductivity: 2.5W/mK Material: Phase Change Pad
Phase Change Softening Temp: 50℃~60℃ Applicatoin: Netbook And Desktop Components
Highlight:

Electronic Components Phase Change pad

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Low Thermal Resistance Phase Change pad

Low Thermal Resistance Phase Change pad For Electronic Components

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

TIC™800A-AL series is low melting point thermal interface material.At 50℃, TIC™800A-AL series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.

 

TIC™800A-AL series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
 

TIC™800A-AL Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

 

TIIC800A-AL-data sheet.pdf

 

Low Thermal Resistance Phase Change Pad For Electronic Components 0


Features


> 0.021℃-in²/W thermal resistance
> Naturally tacky at room temperature, no adhesive required

> No heat sink preheating required

 

 

Applications


> Power conversion equipment

> Power semiconductors:
> T0 packages, MOSFETs & IGBTs

> Audio and Video components

> Automotive control units

> Motor controllers
> General high pressure interface

 

Typical Properties of TICTM800A-AL Series
Product Name TICTM805A-AL TICTM808A-AL TICTM810A-AL TICTM820A-AL Test Method
Color Gray / Silve Gray / Silver Gray / Silver Gray / Silver Visual
Thickness 0.005" 0.008" 0.010" 0.020" *****
(0.126mm) (0.203mm) (0.254mm) (0.508mm)
Thickness Tolerance ±0.0008'' ±0.0008'' ±0.0012'' ±0.0020'' *****
(±0.019mm) (±0.019mm) (±0.030mm) (±0.050mm)
Density 2.5g/cc Helium Pycnometer
Temperature range -25℃~125℃ *****
Phase Change Softening Temperature 50℃~60℃ *****
Thermal Conductivity 2.5 W/mK ASTM D5470 (modified)
Thermal Impedance @ 50 psi(345 KPa) 0.063℃-in²/W 0.08℃-in²/W 0.097℃-in²/W 0.157℃-in²/W ASTM D5470 (modified)
0.40℃-cm²/W 0.52℃-cm²/W 0.63℃-cm²/W 1.13℃-cm²/W
 
Standard Thicknesses:
0.005"(0.127mm), 0.008"(0.203mm), 0.010"(0.254mm, 0.020"(0.508mm)
Consult the factory alternate thickness.

Standard Sizes:
10"x 16"(254mm x 406mm)

TIC800A-AL series are supplied with a white release paper and a bottom liner.
TIC800A-AL series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for
TIC800A-AL series products.
 
Reinforcement: 
No reinforcement is necessary.

 

 
Low Thermal Resistance Phase Change Pad For Electronic Components 1
 

Independent R&D team

 

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A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

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FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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