High Thermal Conductivity Two-Component Epoxy Resin Thermal Conductivity Potting Adhesive For Power Supply

High Thermal Conductivity Two-Component Epoxy Resin Thermal Conductivity Potting Adhesive For Power Supply

TIE^®280-15AB is a two-component epoxy resin sealantwithgood thermal conductivity and room temperature curing properties. It can complete the curing process at room temperature and is convenient for on-site operation and construction. And this material has excellent fire and flame retardant properties, which can meet the high safety requirements of electronic devices.It is particularly suitable for the sealing protection of capacitors,small electronic components,and precision circuit modules,and can provide long-term reliable mechanical support and environmental protectionfor sensitive components.

Feature

> Good thermal conductive: 1.5W/mK
> Excellent insulation and smoothly sourface.

> Low shrinkage
> Low viscosity, expediting air releaseed.

> Excellent in solvents and water proof.
> Excellent thermal shock efficiecy and impact resistance
 

Applications

> Automotive starters potting; General potting;

> Thermal detector potting
> Ferrite adhesion; TIP type LED; Good adhesion toaromatic polyester
> Relay sealant;Good adhesion to rubber, ceramics,PCB and plastics
> Power transformers and coils; Potting capacitors;Potting of small electrical devices
> Adhesion to metal glass and plastic;LCD & substrates adhesion;
> Coating and sealant; Coil ; IGBTS;Transformer; Fire retardant
> Optical / medical component adhesive

Instruction For Use

1. Mixing

Resin is prone to sedimentation and stratification during transportation or storage; therefore, it must be thoroughly stirred before use.Weigh the resin (Part A) and curing agent (Part B) accurately according to the recommended mixing ratio, then pour them into a clean container for blending. The weighing equipment shall meet the accuracy requirements to ensure the ratio is precise and error- free. lf the ambient temperature is below 18℃, it is recommended to preheat Part A in an oven at 50℃ for 45 minutes to improve the fluidity of the mixed adhesive.

Caution: The preheating temperature during mixing is strictly prohibited to exceed 50℃, as high temperatures will drastically shorten the working life of the adhesive.First, stir manually for 2-3 minutes. During the stiring process, continuously scrape the bottom and inner walls of the container to ensure the adhesive is mixed uniformly. If conditions permit, perform additional mechanical stiring for another 2~3 minutes. High-speed operation shall be avoided during stirring to prevent air bubble generation or further shortening of the adhesive's working life caused by frictional heating.

 

2. Vacuumizing

To completely remove the air bubbles mixed into the adhesive during stirring, it is necessary to perform vacuum degassing treatment on the blended adhesive.Set the vacuum degree to.1-5 mmHg. During the vacuumizing process, air bubbles inside the adhesive will continuously precipitate and float to the surface. Maintain the vacuum until the bubbles are basically eliminated; the degassing time is generally 3-10 minutes.

 

3. Application

Inject the blended and degassed adhesive into the target mold. Moderate preheating of the mold can reduce the adhesive viscosity and improve its fluidity, ensuring the adhesive fully encapsulates all areas of the coils or assemblies to be potted.For application scenarios with high requirements for encapsulation compactness and reliability,it is necessary to conduct a second vacuum treatment after glue injection to completely eliminate residual bubbles inside the adhesive and at the contact surfaces between the adhesive and the assemblies.The curing process can be performed in accordance with the recommended curing procedure specified in the product documentation. To further enhance the adhesive's bonding strength, compactness and weather resistance, it is recommended to carry out an additional post-curing process with heating after the completion of initial curing. Post-curing can generally be conducted at the maximum curing temperature specified in the product specification sheet, with constant-temperature baking for 2~4 hours; alternatively, the curing process parameters can be adjusted according to actual application requirements.

 

Application Considerations

Please read the safety and health-related technical documents carefully prior to use, and strictly comply with all requirements specified in the product labels and safety data sheets.To ensure the long-term stable performance and reliability of the electronic encapsulated assemblies, it is necessary to perform thorough cleaning of the component surfaces to remove attached contaminants such as dust, moisture, salts and grease before each potting operation.Such impurities are prone to causing quality defects including short circuits, insufficient bonding strength and substrate corrosion after encapsulation, which will seriously impair the service life of the products.

Storage Guidelines

The resin and curing agent shall be stored in original sealed containers and placed in a cool and dry area, which can effectively extend the product shelf life. Storage methods and ambient temperature are key factors affecting the product shelf life, and must be strictly followed as required

Compatibility

Certain chemicals, such as plasticizers in the curing agent, may inhibit the curing of this product. This issue can be resolved by cleaning the substrate surface with a solvent or performing slight baking at a temperature slightly higher than the curing temperature. Special attention should be paid to the following materials:Organic substances containing elements such as N, P and S, and ionic compounds containing metal ions such as Sn, Pb, Hg, Bi and As. Alkyne and polyvinyl-containing compoundsCondensation-type adhesives, as well as molds and tools contaminated by such adhesive.

 

Safety/Hygiene

Similar to other resin-based products, this product is irritating to human skin and eyes. Some individuals may experience allergic reactions characterized by skin rashes and itching after skin contact with this product or inhalation of its volatile vapors. In high- temperature operating environments, it may also trigger respiratory odor hypersensitivity.

Special Warning: Component B (curing agent) is corrosive. Direct contact with skin or eyes can cause chemical burns. Some divagctvva symptoms including rashes, itching and dificulty breathing.A comprehensive set of hygiene and safety protection measures must be established during the handling of this product.

 

Operators shall wear safety goggles and chemical protective clothing to avoid direct contact with the product. For details on engineering control schemes, selection of personal protective equipment and emergency response measures after accidental contact, please refer to the Product Safety Data Sheet (SDS).

 

Package:

 

1KG A/B for each tank. 5KG A/B each. 10KG A/B each.

 

Comapny Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.