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Silicone Thermal Conductive Putty Thermal Gap Filler Gel Manufacturer

Silicone Thermal Conductive Putty Thermal Gap Filler Gel Manufacturer

  • Silicone Thermal Conductive Putty Thermal Gap Filler Gel Manufacturer
  • Silicone Thermal Conductive Putty Thermal Gap Filler Gel Manufacturer
Silicone Thermal Conductive Putty Thermal Gap Filler Gel Manufacturer
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF070-11
Payment & Shipping Terms:
Minimum Order Quantity: 1000tube
Price: 0.1-100USD/KG
Packaging Details: 300cc/tube
Delivery Time: 3-8 WORK DAYS
Payment Terms: T/T
Supply Ability: 10000KG/MONTH
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Detailed Product Description
Products Name: Manufacturer Hot Sale Silicone Thermal Conductive Putty Thermal Gap Filler Thermal Gel Application: Heat-sink & Frame
Color: Gray Keywords: Silicone Thermal Gel
Flame Rating: UL 94 V-0 Certifications: RoHS
Thermal Conductivity: 7.0 W/m-K SPecific Gravity: 3.0g/cc
Highlight:

Silicone Thermal Conductive Putty

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Thermal Gap Filler Gel

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Thermal Gap Filler Gel Manufacturer

Manufacturer Hot Sale Silicone thermal conductive Putty Thermal Gap Filler Thermal Gel
 
TIFTM070-11 is a soft silicone putty thermal gap filler,which blend with exclusiveformula,that offer superior thermal performance, and compressibility.Due to TIFTM070-11 is made by high vicosity silicon oil ,that can prevent thermalformula seprate from it.Besides ,compared with traditionally thermal pad, it cancontrol bonded shifiting issue much better.


TIFTM070-11 operation mold is simliar as grease ,such as silkprint and screen printor automatic injected facility.TIFTM070-11 can be applied on chip micro processor,PPGAs,Micro BGApackage,BGA package,DSP chip,LED lighting and other high power electriccomponent.
 
 TIF070-11-silicone-putty-thermal-gap-filler.pdf
 
Silicone Thermal Conductive Putty Thermal Gap Filler Gel Manufacturer 0
 
Feature
>Thermal conductivity
>Soft, very low compression

>Low thermal inpedance
>Operate automaticly
>Proven long-term reliability

 
Application
>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver

>Micro heat pipe
>Vihicel enginee controler

>Telecom industry
>Semiconductor 'automatic laboratory equipment.

 
TIFTM070-11 Property
Color Gray Visual
Construction & Composition Ceramic filled silicon material **********
Viscosity 21280000 cps GB/T 10247
Specific Gravity 3.50 g/cc ASTM D297
Thermal conductivity 7.0 W/mK ISO 22007-2
Thermal diffusivity 2.80 mm2/s ISO 22007-2
Specific heat capacity 2.70 MJ/m3K ISO 22007-2
Continuous Use Temperature -40 ~150°C ******
Dielectric breakdown strength 200 V/mil ASTM D149
Flame Rating 94V0 E331100
 
Packing details

30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.
Please contact us for confirming.
 

Company Profile
 
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 Silicone Thermal Conductive Putty Thermal Gap Filler Gel Manufacturer 1


FAQ:
 
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
 

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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