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4.0W/m·K Single Component Silicone Thermal Gel High Performance Heat Conductive Putty Gap Filler Paste For CPU GPU LED Cooling

4.0W/m·K Single Component Silicone Thermal Gel High Performance Heat Conductive Putty Gap Filler Paste For CPU GPU LED Cooling

  • 4.0W/m·K Single Component Silicone Thermal Gel High Performance Heat Conductive Putty Gap Filler Paste For CPU GPU LED Cooling
  • 4.0W/m·K Single Component Silicone Thermal Gel High Performance Heat Conductive Putty Gap Filler Paste For CPU GPU LED Cooling
4.0W/m·K Single Component Silicone Thermal Gel High Performance Heat Conductive Putty Gap Filler Paste For CPU GPU LED Cooling
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF040-06
Document: TIF040-06_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000tube
Price: 0.1-100USD/KG
Packaging Details: 30cc/PCS,50cc/pcs
Delivery Time: 3-8 WORK DAYS
Payment Terms: T/T
Supply Ability: 10000KG/MONTH
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Detailed Product Description
Products Name: 4.0W/m·K Single Component Silicone Thermal Gel High Performance Heat Conductive Putty Gap Filler Paste For CPU GPU LED Cooling Density: 3.2 G/cm³
Application: CPU GPU LED Cooling Color: Gray
Materail: Ceramic Filled Silicon Material Recommended Operating Temperature (℃): -40-200 ℃
Thermal Conductivity: 4.0W/m-K Keyword: Thermal Gel
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CPU GPU LED cooling paste

4.0W/m·K Single Component Silicone Thermal Gel High Performance Heat Conductive Putty Gap Filler Paste For CPU GPU LED Cooling
TIF®040-06 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both high thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment.
Key Features
  • High Thermal conductivity
  • Soft, requires almost no pressure against components
  • Low thermal impedance
  • Easily adaptable for automated dispensing system operations
  • Proven long-term reliability
Applications
  • Heat-sink & frame
  • LED backlight module, LED lighting
  • High speed hardware driver
  • Micro heat pipe radiator
  • Vehicle engine controller
  • Communication hardware
  • Semiconductor automatic laboratory equipment
Typical Properties of TIF®040-06 Series
Property Value Test Method
Color White Visual
Construction Ceramic filled silicon material ZKTM J024
Flow Rate (g/min) 40 ZKTM B014 (30cc syringe/ 2.5mm orifice/90 psi)
Density (g/cm³) 3.2 ASTM D792
Thermal conductivity (W/mK) 4.0 ASTM D5470
Thermal impedance (℃*in²/W) @10psi 0.080 ASTM D5470
Thermal impedance (℃*in²/W) @50psi 0.070 ASTM D5470
Recommended Operating Temperature(℃) -40~200 ZKTM J025
Breakdown Strength (V/mm) ≥8000 ASTM D149
Bond Line Thickness (mm) 0.15 ZKTM B047
Oil Separation(%)@150℃,24hrs <0.03 HG/T 2502
Volatility Loss (%) @150°C, 24 hrs <0.2 HG/T 2502
Flame Rating V-0 UL 94
Packing Details
30 cc/pc, 50 cc/pc, 300 cc/pc, or custom packaging for automated applications.
For more information about thermal conductive materials, please contact our company.
TIF®040-06 Thermal Gel product illustration
Company Profile
Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:
  • Thermal gap pad
  • Thermal graphite sheet/film
  • Thermal double-sided tape
  • Thermal insulation pad
  • Thermal grease
  • Phase change material
  • Thermal gel
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Frequently Asked Questions
Q: What is Thermal Gel?
A: Thermal gel is a TIM (Thermal Interface Material) with good flowability and gap-filling capability. It can be applied through dispensing, coating, or other application methods to fill gaps between heat sources and cooling structures.
Q: What is the main advantage of Thermal Gel?
A: The main advantage of thermal gel is its ability to adapt to complex structures and irregular gaps. It is particularly suitable for applications where multiple components with different heights need to be thermally managed simultaneously.
Q: What size gap is Thermal Gel suitable for?
A: The applicable gap range varies depending on the specific thermal gel. It should be determined based on the product's flowability, curing characteristics, and assembly structure.
Q: Will Thermal Gel flow or leak?
A: Different thermal gels have different rheological properties. During engineering design, factors such as high-temperature sag, flow behavior, and long-term stability should be evaluated to ensure reliable performance.
Q: Does Thermal Gel need to be cured?
A: It depends on the product type. Some thermal gels are non-curing, while others are designed to cure after application. The appropriate type should be selected according to the customer's production process and operating environment.
Q: What is the difference between Thermal Gel and Thermal Grease?
A: Thermal gel generally provides better gap-filling and shape-retention capabilities, while thermal grease is primarily used for very thin interface layers. The appropriate choice depends on the required gap, assembly conditions, and long-term reliability requirements.
Q: Can Thermal Gel be used in battery packs?
A: Yes. Thermal gel can be applied between battery cells, modules, cooling structures, and other components requiring thermal management. The selected product should meet the battery pack's requirements for electrical insulation, flame resistance, temperature resistance, and long-term reliability.
Q: Is Thermal Gel suitable for AI servers?
A: Yes. For GPUs, CPUs, power components, and other components with significant height differences or complex structures, thermal gel provides excellent gap-filling capability and can help improve thermal transfer.

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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