Name: Manufacture Thermal Conductive Silicone Potting For Electronic Components
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF015-07
Price: 49.10 USD
Availability: InStock

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Manufacture Thermal Conductive Silicone Potting For Electronic Components

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF015-07

Payment & Shipping Terms:

Minimum Order Quantity:	1000tube
Price:	0.1-100USD/KG
Packaging Details:	300cc/tube
Delivery Time:	3-8 WORK DAYS
Payment Terms:	T/T
Supply Ability:	10000KG/MONTH

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Detailed Product Description

Products Name:	Manufacture Thermal Conductive Silicone Potting For Electronic Components	Application:	Electronic Components
Color:	Green	Materail:	Ceramic Filled Silicon Material
Continuous Use Temp:	-45-200 ℃	Thermal Conductivity:	1.5W/m-K
Keyword:	Thermal Conductive Silicone Potting
Highlight:	Silicone Thermally Conductive Putty , LED Lighting Thermally Conductive Putty , 1.5W/MK thermally conductive gap filler

Manufacture Thermal Conductive Silicone Potting For Electronic Components

TIF015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF100-15 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

TIF015-07 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF100-15 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component.

TIF015-07 Series Datasheet-REV02.pdf

Feature
> Thermal conductivity: 1.5 W/mK

> Soft, very low compression

> Low thermal inpedance

> Operate automaticly
> Proven long-term reliability

Application
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling

TIF^TM015-07 Property
Property	Value	Test method
Color	Green	Visual
Construction & Composition	Ceramic filled silicon material	*****
Viscosity	4000 Pa.s	GB/T 10247
Specific Gravity	2.5g/cm³	ASTM D297
Thermal conductivity	1.5 W/mK	ISO 22007-2
Thermal diffusivity	0.847 mm²/s	ISO 22007-2
Specific heat capacity	2.2 MJ/m³K	ISO 22007-2
Continuous Use Temperature	-45 ~200°C	******
Flame Rating	94V0	UL E331100

Packing details

30 cc/pc, 98 pc/box;

300 cc/pc , 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

Company Profile

With professional R&D capabilities and over 19 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Q&A

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Tag:

Contact Person: Dana Dai

Tel: +86 18153789196

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Manufacture Thermal Conductive Silicone Potting For Electronic Components

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