Two-Component Silicone Thermally Conductive Gel Material Gap Filler For Electronics Components

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Ziitek TIF^®050AB-11S is a high thermal conductivity_liquid gap-filling material adopting a two-component formulation, which can be tailored to differentiated curing requirements under varying temperatures.Specificallyengineered for low-stress assembly scenarios and high compressive modulus application requirements, this material forms intimate contact with mating surfaces during electronic product assembly, effectively reducing contact thermal resistance while delivering excellent electrical insulation performance.After curing, its performance is equivalent to that of thermal conductive silicone sheets, with outstanding high-temperature resistance and anti-aging stability.

Features

> Notebook
> Set top boxes
> Monitoring the Power Box
> Display card
> Mainboard/mother board
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

Product Specification:

50 cc/pcs, 400 cc/pcs,or customized packaging for automation applications.
For information on products of different specifications, please contact our company.
If you want to learn more about our thermal conductivity products, please visit our oficial website.