Thermal Conductive Silica Gel With High Thermal Conductivity 7.0W/mK For CPU Heat Dissipation

TIF®070-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both high thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment.

30 cc/pcs, 50cc/pcs, 300 cc/pcs, or custom packaging for automated applications.

For more information about thermal conductive materials, please contact our company.

Ziitek, founded in 2006, has been deeply involved in the field of thermal management for nearly 20 years, and is a high-tech enterprise integrating R&D, production and sales. With the rapid development of industries such as new energy vehicles, energy storage systems, high-performance CPU/GPU chips, AI intelligent automation, 5G communication and aerospace, Zhaoke has developed many kinds of products such as thermal pads, thermal pastes, phase change materials, EMI shielding materials, heating films, foamed silicone seals and so on with the continuous independent innovation of senior engineers, which accurately matches the heat dissipation and sealing needs of various industries. Headquartered in Dongguan, the company has set up production bases in Kunshan, Taiwan Province and Viet Nam to quickly respond to global customers.