| Place of Origin: | China |
| Brand Name: | Ziitek |
| Certification: | UL |
| Model Number: | TIF030AB-05R |
| Document: | TIF030AB-05R_Data Sheet.pdf |
| Minimum Order Quantity: | 1000tube |
|---|---|
| Price: | 0.1-100USD/tube |
| Packaging Details: | 50cc/tube |
| Delivery Time: | 3-8 work days |
| Payment Terms: | T/T |
| Supply Ability: | 100000tubes/MONTH |
| Products Name: | Thermal Conductive Gel Two Parts Liquid Gap Filling Material With 3.0W/mK High Thermal Conductivity For Heat Dissipation In Electronics | Application: | Heat Dissipation In Electronics |
|---|---|---|---|
| Color: | Blue | Cure @25℃: | 45 Min |
| Cure @70℃: | 10 Min | Thermal Conductivity: | 3.0W/mK |
| Density: | 3.1g/cm³ | Keywords: | Thermally Conductive Gel |
| Highlight: | Thermal conductive gel for electronics,Liquid gap filling material 3.0W/mK,High thermal conductivity heat dissipation gel |
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| Uncured Material Properties | ||
|---|---|---|
| Construction | Ceramic filled silicon material | - |
| Color/Part A | White | Visual |
| Color/Part B | Blue | Visual |
| Flow Rate (g/min) | 25 | Ziitek Test Method (50 cc syringe/1.5 mm orifice/90 psi) |
| Bond Line Thickness (mm) | 0.15 | - |
| Thermal Resistance (℃*in²/W) @10psi | 0.09 | ASTM D5470 |
| Thermal Resistance (℃*in²/W) @50psi | 0.08 | ASTM D5470 |
| Mix Ratio | 1:1 | - |
| Cure Schedule | ||
| Cure @25℃ | 45 min | Ziitek Test Method |
| Cure @70℃ | 10 min | Ziitek Test Method |
| Cure Material Properties | ||
| Color | Blue | Visual |
| Hardness (Shore 00) | 50 | ASTM D2240 |
| Density (g/cm³) | 3.1 | ASTM D792 |
| Thermal Conductivity (W/mK) | 3.0 | ASTM D5470 |
| Breakdown Strength (V/mm) | ≥5500 | ASTM D149 |
| Volume Resistivity (Ohm-cm) | >1.0x10¹¹ | ASTM D257 |
| Recommended Operating Temperature (°C) | -40~200℃ | - |
| Flame Rating | V-0 | UL 94 |
Contact Person: Dana Dai
Tel: +86 18153789196