Name: Soft Silicone Based Thermal Conductive Gel With Excellent 3.0W Thermal Conductivity Providing Heat Dissipation For Telecom Industry
Brand: Dongguan Ziitek Electronical Material and Technology Co., Ltd
SKU: TIF030-10
Price: 49.10 USD
Availability: InStock

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Soft Silicone Based Thermal Conductive Gel With Excellent 3.0W Thermal Conductivity Providing Heat Dissipation For Telecom Industry

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF030-10
Document:	TIF030-10_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000tube
Price:	0.1-100USD/KG
Packaging Details:	30cc/PCS，50cc/pcs
Delivery Time:	3-8 WORK DAYS
Payment Terms:	T/T
Supply Ability:	10000KG/MONTH

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Detailed Product Description

Products Name:	Soft Silicone Based Thermal Conductive Gel With Excellent 3.0W Thermal Conductivity Providing Heat Dissipation For Telecom Industry	Density:	2.9 G/cm³
Color:	Gray	Materail:	Ceramic Filled Silicon Material
Recommended Operating Temperature (℃):	-40-200 ℃	Thermal Conductivity:	3.0W/m-K
Keyword:	Thermal Conductive Gel	Application:	Telecom Industry
Highlight:	soft silicone thermal conductive gel , thermal conductive gel for telecom , 3.0W thermal conductivity gel

TIF ®030-10 Soft Silicone Based Thermal Conductive Gel

TIF^®030-10 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both high thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment.

Key Features

High Thermal Conductivity (3.0 W/mK)
Soft with Very Low Compression
Low Thermal Impedance
Suitable for Automated Operation in Dispensing Systems
Proven Long-term Reliability

Applications

Heat-sink & Frame
LED Backlight Module, LED Lighting
High Speed Hardware Driver
Micro Heat Pipe Radiator
Vehicle Engine Controller
Communication Hardware
Semiconductor Automatic Laboratory Equipment

Typical Properties of TIF^®030-10

Property	Value	Test Method
Color	Gray	Visual
Construction	Ceramic filled silicon material	-
Flow Rate (g/min) (30cc syringe/2.5mm orifice/90 psi)	12	Ziitek Test Method
Density (g/cm³)	2.9	ASTM D792
Thermal Conductivity (W/mK)	3.0	ASTM D5470
Thermal Impedance (℃-in²/W) @10psi	0.11	ASTM D5470
Thermal Impedance (℃-in²/W) @50psi	0.10	ASTM D5470
Recommended Operating Temperature	-40~200℃	-
Breakdown Strength (V/mm)	≥4000	ASTM D149
Volume Resistivity (Ohm*cm)	＞1.0×10¹¹	ASTM D257
Bond Line Thickness (mm)	0.10	-
Flame Rating	V-0	UL 94
Oil Separation (%) @150°C, 24 hrs	＜0.03	-
Volatility Loss (%) @150°C, 24 hrs	＜0.2	-

Packing Details

30 cc/pc, 50 cc/pc, 300 cc/pc

For more information about thermal conductive materials, please contact our company.

Company Profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

Thermal gap pad
Thermal graphite sheet/film
Thermal double-sided tape
Thermal insulation pad
Thermal grease
Phase change material
Thermal gel

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Frequently Asked Questions

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.

Q: What are thermal pads used for?

A: Thermal pads transfer heat away from hot electronic parts like computer chips into a metal cooler or heat sink. They fill empty air spaces between surfaces, provide electrical safety, and keep parts from getting too hot.

Tag:

heat transfer putty,

thermally conductive gap filler,

heat insulation putty

Contact Details

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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Soft Silicone Based Thermal Conductive Gel With Excellent 3.0W Thermal Conductivity Providing Heat Dissipation For Telecom Industry

Soft Silicone Based Thermal Conductive Gel With Excellent 3.0W Thermal Conductivity Providing Heat Dissipation For Telecom Industry

soft silicone thermal conductive gel

thermal conductive gel for telecom

3.0W thermal conductivity gel

heat transfer putty,

thermally conductive gap filler,

heat insulation putty