Name: Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler for Telecon industry
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF090-11
Price: 49.10 USD
Availability: InStock

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Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler for Telecon industry

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF090-11

Payment & Shipping Terms:

Minimum Order Quantity:	1000tube
Price:	0.1-100USD/KG
Packaging Details:	300cc/PCS，6PCS/Box
Delivery Time:	3-8 WORK DAYS
Payment Terms:	T/T
Supply Ability:	10000KG/MONTH

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Detailed Product Description

Products Name:	Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler For Telecon Industry	Application:	Electronic Components
Color:	Gray	Materail:	Ceramic Filled Silicon Material
Continuous Use Temp:	-45-200 ℃	Thermal Conductivity:	9.0W/m-K
Keyword:	Silicone Thermal Gel	Specific Gravity:	3.45 G/cc
Highlight:	Good Thermal Conductive Silicone Thermal Gel , Silicone Putty Thermal Gap Filler , 9.0W Silicone Thermal Gel

Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler for Telecon industry

TIF^®090-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIFo90-11 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular silicon chips, LED lighting, and other high-power electronic components.

Feature

> Thermal conductivity: 9.0W/mK

> Soft, very low compression

> Low thermal inpedance

> Operate automaticly
> Proven long-term reliability

Application

> Heat-sink & frame
> LED backlight module,LED lighting

> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controler

> Telecom industry
> Semiconductor automatic laboratory equipment

TIF^®090-11 Typical Property
Property	Value	Test method
Color	Gray	Visual
Construction & Composition	Ceramic filled silicon material	*****
Flow Rate(g/min)	20	Ziitek Test Methbod (30cc syringe/ 2.5mm or rifice/90 psi)
Density(g/cm³)	3.45	ASTM D792
Thermal conductivity(W/mK)	9.0	ASTM D5470
Thermal resistance @10Psi(℃-in²/W)	0.089	ASTM D5470
Thermal resistance @50Psi(℃-in²/W)	0.055	ASTM D5470
Recommended Operating temp	-45~200℃	*****
Breakdown Voltage(V/mm)	≥4000	ASTM D149
Bond line Thickness (mm)	0.4	Ziitek Test Method
Shelf life	12 months	****
Flame Rating	V-0	UL 94

Packing details

30 cc/pc, 98 pc/box;

300 cc/pc , 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

Company Profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Q&A

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Tag:

heat transfer putty,

thermally conductive gap filler,

heat insulation putty

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler for Telecon industry

Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler for Telecon industry

Good Thermal Conductive Silicone Thermal Gel

Silicone Putty Thermal Gap Filler

9.0W Silicone Thermal Gel

heat transfer putty,

thermally conductive gap filler,

heat insulation putty