High performance Heat Resistant Cooling Gel silicone Gap Filler Thermal Putty conductive for Power CPU GPU

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

TIF015-07-Specification-sheet.-pdf.pdf

TIF015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and

compressibility.Due to TIF015-07 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

TIF015-07 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility.

TIF015-07 can be applied on chip micro processor,PPGAs,MicroBGA package,BGA package,DSP chip,LED lighting and other high power electric component .

< Good thermal conductive:1.5W/mK

< Soft,very low compression
< Low thermal inpendance
< Operate automaticly

Applications

< Heat-sink & frame
< LED backlight module,LED light
< Micro heat pipe
< Vihicle enginee controler
< Telecom industey

< Semiconductor

Product packing details:

30cc/pc , 98cc/pc,300cc/pc, 6pcs/box
We offer the custom packaged in Syringes for automated despensing applications.

Please contact us for confirming.