The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Gay
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello SAU
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
Electric Thermal Pad Silica Gap Filler Thermal Pad With Durable Silicone Material For AI Processors Product Overview TIF®100-20-10F Series is a structurally supportive thermal pad designed to provide excellent ... Read More
Ultra Soft Naturally Tacky 2.0W/mK Blue Thermal Gap Filler Silicone Rubber Sheet Operating Temperature Range: -40°C to 200°C Product Overview TIF®100-20-05U Series is an ultra-soft thermal interface material ... Read More
Thermal Conductive Silicone Thermal Pad 2.0W/mK For Heat Transfer In AI Processors And AI Server Hardware Applications Product Overview TIF®100-20-05S Series is a well-balanced, general-purpose thermal pad. It ... Read More
2.0W/mK Ceramic Filled Silicone Thermal Pad for AI Processors and Server Applications Product Overview TIF®100-20-02U Series is an ultra-soft thermal interface material designed specifically to protect ... Read More
Thermal Conductive Pad 2.0W/mK Thermal Conductivity Material With Natural Tackiness For Application In Electronic Cooling Product Overview TIF®100-20-02S Series is a well-balanced, general-purpose thermal pad. ... Read More
Thermal Conductive Pad 1.5W/mK Silicone Thermal Interface Material For Heat Transfer In AI Processors AI Servers Product Overview TIF®100-19U Series is an ultra-soft thermal interface material designed ... Read More
Thermal Conductive Pad Silicone Thermal Interface Material For Enhancing Heat Transfer Efficiency In GPU CPU Components Product Overview TIF®100-20-05E Series is a well-balanced, general-purpose thermal pad ... Read More
Flexible Thermal Gap Filler For In Filling Air Gaps Between Heating Elements And Heat Dissipation Fins To Enhance Cooling Efficiency TIF®100-18-02S Series is a well-balanced, general-purpose thermal pad that ... Read More
Durable Silicone Thermal Pad Providing Excellent Thermal Conductivity And Electrical Insulation For Electronic Components Product Overview TIF®100-16-38UF Series is a structurally supportive thermal pad ... Read More
Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates TIF®100-15-11F Series is a structurally supportive thermal pad designed to provide ... Read More